Semiconductor industry: micro, strengthen the foundation of science and technology

Semiconductor manufacturing is extremely precise. Our CNC precision machining technology, in the wafer cutting process, the cutting accuracy can reach ±0.005mm, effectively reduce the chip cutting process of edge breakage phenomenon, improve the chip yield to more than 98%. In the chip packaging mold manufacturing, it can achieve high-precision reproduction of complex three-dimensional structures, and the feature size error is controlled within ±0.01mm, which lays a solid foundation for the efficient production and reliable performance of semiconductor chips.